PD168302_15 Datasheet, PDF (12/14 Pages) Renesas Technology Corp – MONOLITHIC 2CH H-BRIDGE DRIVER

µPD168302
9. RECOMMENDED SOLDERING CONDITIONS
The µPD168302 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
µPD168302MA-6A5: 24-pin plastic TSSOP (5.72 mm (225))
Soldering Method
Soldering Conditions
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds MAX. (at 220°C or
higher), Count: Three times or less, Exposure limit: None, Flux: Rosin flux with
low chlorine (0.2 Wt% or below) recommended
Recommended
Condition
symbol
IR60-00-3
Caution Do not use different soldering methods together (except for partial heating).
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Data Sheet S16402EJ1V0DS