R32C111 Datasheet, PDF (100/102 Pages) Renesas Technology Corp – RENESAS MCU

Revision History
R32C/111 Group Datasheet
Rev.
Date
1.30 Mar 3, 2014
Page
66
68
69
78, 90
81, 93
98-99
—
—
—
1
2, 4
5
6
20, 23
—
—
65, 77
66, 78
Description
Summary
• Changed expression “Programming and erasure endurance” in Table
5.8 to “Program and erase cycles”; Changed its unit “times” in the table
and Note 1 to “Cycles”
• Changed order of descriptions of “t_rec(STOP)” and “t_rec(WAIT)” in Table
5.13 and Figure 5.4
• Changed expressions “CS0” and “A23 to A0, BC0 to BC3” in Figure
5.5 to “Chip select” and “Address”, respectively
• Corrected “INTi” in title of Tables 5.32 and 5.55 to “INTi”
• Added measurement condition to Tables 5.37 and 5.60
Appendix 1. Package Dimensions
• Added a seating plane to the drawing of package dimension
Fifth edition released
• Deleted description for the 80-pin package
Chapter 1. Overview
• Modified wording and enhanced description in this chapter
• Modified expression “I²C” in line 9 of 1.1 to “I²C-bus interface”
• Modified expressions “calculation transfer” and “chained transfer” in
Tables 1.1 and 1.3 to “calculation result transfer” and “chain transfer”,
respectively
• Deleted N version from the Operating Temperature row in Table 1.4
• Deleted products on planning phase from Table 1.5
• Modified expression “I²C bus” in Tables 1.13 and 1.16 to “I²C-bus”
Chapter 2. CPU
• Modified wording and enhanced description in this chapter
Chapter 5. Electrical Characteristics
• Modified wording and enhanced description in this chapter
• Deleted TXD4, STXD4, and RTS4 from Tables 5.16 and 5.39
• Modified description “Drive power” in Tables 5.17 and 5.40 to “Drive
strength”
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