|
UPD48576209F1 Datasheet, PDF (1/54 Pages) Renesas Technology Corp – 576M-BIT Low Latency DRAM | |||
|
µPD48576209F1
µPD48576218F1
µPD48576236F1
Datasheet
576M-BIT Low Latency DRAM
Common I/O
R10DS0256EJ0101
Rev. 1.01
Jan. 15, 2016
Description
The µPD48576209F1 is a 67,108,864-word by 9 bit, the µPD48576218F1 is a 33,554,432 word by 18 bit and the
µPD48576236F1 is a 16,777,216 word by 36 bit synchronous double data rate Low Latency RAM fabricated with
advanced CMOS technology using one-transistor memory cell.
The µPD48576209F1, µPD48576218F1 and µPD48576236F1 integrate unique synchronous peripheral circuitry and a
burst counter. All input registers controlled by an input clock pair (CK and CK#) are latched on the positive edge of CK
and CK#. These products are suitable for application which require synchronous operation, high speed, low voltage,
high density and wide bit configuration.
Specification
⢠Density: 576M bit
⢠Organization
- Common I/O: 8M words x 9 bits x 8 banks
4M words x 18 bits x 8 banks
2M words x 36 bits x 8 banks
⢠Operating frequency: 533 / 400 / 300 MHz
⢠Interface: HSTL I/O
⢠Package: 144-pin FBGA
- Package size: 18.5 x 11
- Lead free
⢠Power supply
- 2.5 V VEXT
- 1.8 V VDD
- 1.5 V or 1.8 V VDDQ
⢠Refresh command
- Auto Refresh
- 16K cycle / 32 ms for each bank
- 128K cycle / 32 ms for total
⢠Operating case temperature : Tc = 0 to 95°C
Features
⢠SRAM-type interface
⢠Double-data-rate architecture
⢠PLL circuitry
⢠Cycle time: 1.875 ns @ tRC = 15 ns
2.5 ns @ tRC = 15 ns
2.5 ns @ tRC = 20 ns
3.3 ns @ tRC = 20 ns
⢠Non-multiplexed addresses
⢠Multiplexing option is available.
⢠Data mask for WRITE commands
⢠Differential input clocks (CK and CK#)
⢠Differential input data clocks (DK and DK#)
⢠Data valid signal (QVLD)
⢠Programmable burst length: 2 / 4 / 8 (x9 / x18 / x36)
⢠User programmable impedance output (25 ⦠- 60 â¦)
⢠JTAG boundary scan
R10DS0256EJ0101 Rev. 1.01
Jan. 15, 2016
Page 1 of 53
|
▷ |