HYB18L256160BCX-7.5 Datasheet, PDF (44/48 Pages) Qimonda AG – DRAMs for Mobile Applications 256-Mbit Mobile-RAM

4
Package Outlines
HY[B/E]18L256160B[C/F]X-7.5
256-Mbit Mobile-RAM
Package Outlines
8 x 0.8 = 6.4
0.8
0.3 D
D ⁵⁾
B ⁴⁾
0.12
+0.01
-0.04
20˚±5˚
2)
A ⁴⁾
3) 1)
0.1 C
0.1 C
0.41 ±0.03
54x
ø0.12 M
ø0.07 M
C
A
B
1.5 ²⁾
4.25
C SEATING PLANE
0.2
12
1) A1 Marking Ballside
2) Die Sort Fiducial
3) Bad Unit Marking (BUM)
4) Middle of Packages Edges
5) Middle of Ball Matrix
Figure 47 P-VFBGA-54-2 (Very Low Profile Fine Pitch Ball Grid Array Package)
Data Sheet
44
Rev. 1.11, 2007-01
07142005-CR47-RB2E