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HYS64T256022EDL Datasheet, PDF (4/40 Pages) Qimonda AG – 200-Pin Dual Die Small-Outline-DDR2-SDRAM Modules | |||
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Internet Data Sheet
HYS64T256022EDLâ[25F/2.5/3/3S/3.7]âB
Small Outline DDR2 SDRAM Modules
1.2
Description
The Qimonda HYS64T256022EDLâ[25F/2.5/3/3S/3.7]âB
module family are Small Outline modules âSO-DIMMsâ with
30 mm height based on DDR2 technology. DIMMs are
available as non-ECC modules in 256M Ã 64 (2 GB)
organization and density, intended for mounting into 200-pin
connector sockets.
The memory array is designed with stacked 1 Gbit Double-
Data-Rate-Two (DDR2) Synchronous DRAMs. Decoupling
capacitors are mounted on the PCB. The DIMMs feature
serial presence detect based on a serial E2PROM device
using the 2-pin I2C protocol. The first 128 bytes are
programmed with configuration data and are write protected;
the second 128 bytes are available to the customer.
Product Type1)
Compliance Code2)
TABLE 2
Ordering Information for RoHS Compliant Products
Description
SDRAM Technology
PC2â6400
HYS64T256022EDLâ25FâB 2GB 2RÃ8 PC2â6400Sâ555â12âD0
2 Ranks, Non-ECC 1 Gbit (Ã8)
PC2â6400
HYS64T256022EDLâ2.5âB 2GB 2RÃ8 PC2â6400Sâ666â12âD0
2 Ranks, Non-ECC 1 Gbit (Ã8)
PC2â5300
HYS64T256022EDLâ3âB
2GB 2RÃ8 PC2â5300Sâ444â12âD0
2 Ranks, Non-ECC 1 Gbit (Ã8)
PC2â5300
HYS64T256022EDLâ3SâB 2GB 2RÃ8 PC2â5300Sâ555â12âD0
2 Ranks, Non-ECC 1 Gbit (Ã8)
PC2â4200
HYS64T256022EDLâ3.7âB 2GB 2RÃ8 PC2â4200Sâ444â12âD0
2 Ranks, Non-ECC 1 Gbit (Ã8)
1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS64T256022EDLâ3.7âB, indicating
Rev. âBâ dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of
this data sheet.
2) The Compliance Code is printed on the module label and describes the speed grade, for example âPC2â4200Sâ444â12âD0â, where
4200S means SO-DIMM modules with 4.26 GB/sec Module Bandwidth and â444â12â means Column Address Strobe (CAS) latency = 4,
Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and produced on
the Raw Card âDâ.
DIMM Density Module
Organization
2 GByte
256M Ã64
Memory ECC/
Ranks Non-ECC
2
Non-ECC
# of
SDRAMs
16
TABLE 3
Address Format
# of row/bank/columns bits Raw Card
14/3/10
D
TABLE 4
Components on Modules
Product Type1)
DRAM Components1)
DRAM Density
DRAM Organisation
Note
HYS64T256022EDL
HYB18T2G802BF
2 Ã1 Gbit
2Ã 128M Ã8
2)
1) Green Product
2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet.
Rev. 1.0, 2006-11
4
11172006-DXYK-2PPW
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