HYS72T64000HR-3S-B Datasheet, PDF (3/52 Pages) Qimonda AG – 240-Pin Registered DDR2 SDRAM Modules

Internet Data Sheet
1
Overview
HYS72T[64/128/256]xxxHR–[3S/3.7/5]–B
240-Pin Registered DDR2 SDRAM
This chapter gives an overview of the 1.8 V 240-Pin Registered DDR2 SDRAM Modules product family and describes its main
characteristics.
1.1
Features
• 240-Pin PC2–5300, PC2–4200 and PC2–3200 DDR2
SDRAM memory modules for PC, Workstation and Server
main memory applications
• One rank 64M × 72, 128M × 72 and two ranks
128M × 72, 256M x 72 module organization and 512M ×8,
512M × 4 chip organization
• Standard Double-Data-Rate-Two Synchronous DRAMs
(DDR2 SDRAM) with a single + 1.8 V (± 0.1 V) power
supply
• Built with 512 Mbit DDR2 SDRAMs in P-TFBGA-60
chipsize packages.
• Programmable CAS Latencies (3, 4 and 5), Burst Length
(4 & 8) and Burst Type
• Auto Refresh (CBR) and Self Refresh
• Programmable self refresh rate via EMRS2 setting
• Programmable partial array refresh via EMRS2 settings
• DCC enabling via EMRS2 setting
• All inputs and outputs SSTL_18 compatible
• Off-Chip Driver Impedance Adjustment (OCD) and On-Die
Termination (ODT)
• Serial Presence Detect with E²PROM
• RDIMM Dimensions (nominal): 30 mm high, 133.35 mm
wide
• Based on standard reference card layouts Raw Card “A”,
“B“, “C“, ”J”
• All speed grades faster than DDR2–400 comply with
DDR2–400 timing specifications.
• RoHS compliant products¹⁾
Product Type Speed Code
Speed Grade
Max. Clock Frequency
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
TABLE 1
Performance Table
–3S
–3.7
–5
Unit
PC2–5300 5–5–5 PC2–4200 4–4–4 PC2–3200 3–3–3 —
@CL5
f_CK5
333
@CL4
f_CK4
266
@CL3
f_CK3
200
t_RCD
15
t_RP
15
t_RAS
45
t_RC
60
266
200
MHz
266
200
MHz
200
200
MHz
15
15
ns
15
15
ns
45
40
ns
60
55
ns
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.2, 2007-01
3
03292006-JXZQ-CG6T