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PE99153DIE Datasheet, PDF (5/15 Pages) Peregrine Semiconductor – Hi-Rel 6A DC-DC Converter
PE99153 DIE
Product Specification
Table 3. Pin Coordinates and Descriptions
(continued)
Pin
No.
Pin Name
X
Y
Description
25
TCSEL0 –2343.9
148.5
Bandgap Reference Voltage
Fine Adjust (0)
26
TCSEL1 –2343.9
297.2
Bandgap Reference Voltage
Fine Adjust (0)
27
GND –2343.9 500 Ground
28 CCSEL –2343.9 696.1 Course trim code
29
EAINM
–2343.9
869.7
Error Amplifier (–) Input,
Loop to VREF
30
EAINP
–2343.9
1068.3
Error Amplifier (+) Input,
Load Feedback
1.000V Reference output,
31
VREF
–2343.9
1266.9
Loop to AAINP. Additional
Low Pass Filtering May be
Necessary
32 AGND –2142.8 1283.2 Bandgap ground
33
SScap
–1944.2
1283.2
Resistor to Set Reference
Current
34
SYNC
–1745.6
1283.2
Loop-Through Complement
Output
35
SDb
–1547 1283.2 Shutdown (L)/enable input
36
TEST –1348.4 1283.2 Ground
37
GND –2343.9 1437.25 Ground
38
VIN
–397.5 1000 Input Power Supply
39
VIN
1102.5 1000 Input Power Supply
40
VIN
102.5
0
Input Power Supply
41
VIN
1602.5
0
Input Power Supply
42
VIN
–397.5 –1000 Input Power Supply
43
VIN
1102.5 –1000 Input Power Supply
Table 4. Operating Ranges
Symbol
Parameter/Condition
VIN
Power supply voltage
TA
Operating temperature range
(case)
Min Max Unit
4.6 6.0
V
–55 +125 oC
Table 5. Absolute Maximum Ratings
Symbol
Parameter/Condition
Min Max Unit
VIN
Power supply voltage
–0.5 6.5
V
TJ
Operating temperature range
(junction)
–55 +145 oC
TST
Storage temperature range (case) –65 +150 oC
II
DC into any signal input
–10 10 mA
IO
DC into any signal output
–50 50 mA
IP
DC into any single power pin
–2
2
A
Exceeding absolute maximum ratings may cause
permanent damage. Operation between maximum
operating ranges and absolute maximum operating
ranges for extended periods may reduce reliability.
Table 6. Electrostatic Discharge (ESD) Ratings
Model
Parameter/Condition
Min Max Unit
HBM* VESD All pins
1000
V
Note: * Human Body Model ESD Voltage (HBM, MIL_STD 883 Method 3015.7).
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS device, observe the
same precautions that you would use with other
ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Immunity
Unlike conventional CMOS devices, UltraCMOS
devices are immune to latch-up.
ELDRS
The UltraCMOS process does not exhibit enhanced
low-dose-rate sensitivity (ELDRS) since bipolar
minority carrier elements are not used.
Document No. DOC-50371-6 │ www.e2v-us.com
©2012–2015 Peregrine Semiconductor Corp. All rights reserved.
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