U0402FC3.3C_12 Datasheet, PDF (5/8 Pages) Protek Devices – 250W UMBUMPED FLIP CHIP TVS ARRAY

Only One Name Means ProTek’Tion™
SOLDER REFLOW INFORMATION
U0402FC3.3C - U0402FC36C
printed circuit board recommendations
parameter
value
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity (Only applies to bumped devices)
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
Requirements
Temperature:
T_P for Lead-Free (Sn/Ag/Cu): 260-270°C
Preheat time and temperature depends on solder paste and flux activa-
tion temperature, component size, weight, surface area and plating.
recommended non-solder mask
defined pad illustration
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
T_P
Solder Melt
Ramp-Up
(Maximum Temp)
Ramp-Down
05149.R8 10/12
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
Ramp-Up
15 seconds
(Minimize)
Solder-Time Ramp-Down
15-20 seconds
Page 5
www.protekdevices.com