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U0402FC3.3C_12 Datasheet, PDF (1/8 Pages) Protek Devices – 250W UMBUMPED FLIP CHIP TVS ARRAY
Only One Name Means ProTek’Tion™
250w unbumped flip chip tvs array
U0402FC3.3C - U0402FC36C
U0402 package
Description
The U0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level
transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed
specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These
devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per
line for an 8/20µs waveform. In addition, the U0402FCxxC series features superior clamping performance, low leak-
age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates
overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Bidirectional Configuration and Monolithic Structure
• Protection for 1 Line
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Standard EIA Chip Size: 0402
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Solder Reflow Temperature:
• Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Plastic Tape per EIA Standard 481
applications
• Cellular Phones
• MCM Boards
• Wireless Communication Circuits
• IR LEDs
• SMART & PCMCIA Cards
PIN CONFIGURATION
05149.R8 10/12
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