CM300DX1-24NFJ Datasheet, PDF (4/6 Pages) Powerex Power Semiconductors – Dual IGBTMOD NX-Series Module 300 Amperes/1200 Volts

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CM300DX1-24NFJ
Dual IGBTMOD™ NX-Series Module
300 Amperes/1200 Volts
Thermal Characteristics
Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance
(Case to Heatsink)
Symbol
R_th(j-c)Q
R_th(j-c)D
R_th(c-s)
Test Conditions
Per IGBT Part^*2
Per FWDi Part^*2
Per 1 Module^*2,*6
Thermal Grease Applied
Mechanical Characteristics
Characteristics
Symbol
Test Conditions
Mounting Torque
Weight
M_t
Main Terminals, M6 Screw
M_s
Mounting to Heatsink, M5 Screw
m
Flatness of Baseplate
e_c
On Centerline X, Y^*7
*2 Case temperature (T_C) and heatsink temperature (T_f) measured point is just under the chips.
0
0
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
16.2
29.8
Di2 Tr2
47
Di2 Tr2
48
24
Di1 Di1
Tr1 Tr1
23
27.2
38.9
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
LABEL SIDE
92.8 80.5
42.1 28.6
0
Each mark points to the center position of each chip.
Tr1 / Tr2: IGBT
Di1 / Di2: FWDi
*6 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*7 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
Min.
Typ.
Max. Units
—
—
0.066 K/W
—
—
0.093 K/W
—
0.015
—
K/W
Min.
Typ.
Max. Units
31
35
40
in-lb
22
27
31
in-lb
—
330
— Grams
±0
—
±100
µm
MOUNTING SIDE
MOUNTING SIDE
Y
MOUNTING
X SIDE
– : CONCAVE
+ : CONVEX
4
07/11 Rev. 0