PAS6311LT Datasheet, PDF (18/18 Pages) Pixart Imaging Inc. – CMOS VGA DIGITAL IMAGE SESNSOR

PAS6311LT Specification
Recommended Condition For Infrared Reflow
Carefully observe the mounting conditions, recommended temperature profile when
Mounting infrared reflows is show in the figure below.
After mounting on the mother board, it must be dispense epoxy in side of the CSP package.
ô Reflow Profile
3FDPNNFOE
3FGMPX
1SPGJMF
Melting area



Pre-heat



           
5JNF ^{( Sec )}
Recommend Pb-free solder paste vender & type :
1. Almit LFM-48W TM-HP
2. Senju M705-GRN360-K
Programming
rate
1.5~2.5 ^oC/sec
Pre-heat
170~200^oC
90 +/- 30 sec
Melting area
>220^oC 30~50sec
with peak temperature 230~245^oC
ô Dispense Epoxy
Epoxy
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PixArt Imaging Inc.
E-mail: [e-mail]
v1.5 2007/10/02