TDA7000 Datasheet, PDF (9/10 Pages) NXP Semiconductors – FM radio circuit

Philips Semiconductors
FM radio circuit
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
Product specification
TDA7000
SOT102-1
D
L
Z
e
18
pin 1 index
M_E
A_{2 A}
A₁
wM
b₁
b
b₂
10
c
(e ₁)
M_H
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254 0.85
inches _0.19
0.020
0.15
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01 0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT102-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
93-10-14
95-01-23
May 1992
9