BLF6G15L-250PBRN_15 Datasheet, PDF (9/13 Pages) NXP Semiconductors – Power LDMOS transistor

NXP Semiconductors
9. Package outline
Flanged LDMOST ceramic package; 2 mounting holes; 8 leads
D
A
L
D₁
U₁
q
H₁
6
1
α
BLF6G15L-250PBRN
Power LDMOS transistor
SOT1110A
F
B
C
w₂ D
c
2
7
H U₂ Z
p _E1
E
5
A
8
3
b
4
9
b₁
w₃
Q
Dimensions
e
0
5
10 mm
scale
w₁ A B
w₃ Z α
5.97 64°
0.25
5.72 62°
0.235 64°
0.01
0.225 62°
Unit⁽¹⁾
A
b
b₁ c
D D₁ e
E E₁ F
H H₁
L
p Q⁽²⁾ q
U₁ U₂ w₁ w₂
max 5.36 1.14 11.81 0.18 31.55 31.52
9.50 9.53 1.75 17.12 25.53 2.67 3.30 2.26
41.28 10.29
mm nom
13.72
35.56
0.25 0.51
min 3.99 0.89 11.56 0.10 30.94 30.96
9.30 9.27 1.50 16.10 25.27 2.41 3.05 2.01
41.02 10.03
max 0.211 0.045 0.465 0.007 1.242 1.241
0.374 0.375 0.069 0.674 1.005 0.105 0.13 0.089
1.625 0.405
inches nom
0.540
1.4
0.01 0.02
min 0.157 0.035 0.455 0.004 1.218 1.219
0.366 0.365 0.059 0.634 0.995 0.095 0.12 0.079
1.615 0.395
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. dimension is measured 0.030 inch (0.76 mm) from the body.
3. recommended screw pitch dimension of 1.52 inch (38.6 mm) based on M3 screw.
sot1110a_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
SOT1110A
09-11-20
10-02-02
Fig 9. Package outline SOT1110A
BLF6G15L-250PBRN
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 November 2010
© NXP B.V. 2010. All rights reserved.
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