BGF944 Datasheet, PDF (9/12 Pages) NXP Semiconductors – GSM900 EDGE power module

Philips Semiconductors
GSM900 EDGE power module
Product specification
BGF944
PACKAGE OUTLINE
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 3 in-line leads
SOT365C
D
y
U
q
E
A
F
U3
A
U2
p
U1
L
1
23
b
wM
e1
e
Z
vA
c
Q
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
b
c
DE
e e1 F
mm
9.5
9.0
0.56
0.46
0.3
0.2
30.1
29.9
18.6
18.4
2.54 20.32
3.3
3.1
L
p
Qq
U U1 U2 U3
3.7 3.55 4.0 41.75 48.4 15.4 7.75 1.1
3.3 3.45 3.8 41.65 48.0 15.2 7.55 0.0
vw y
Z
0.3
0.25
0.1
12.8
12.6
OUTLINE
VERSION
IEC
SOT365C
2003 Jun 06
REFERENCES
JEDEC
JEITA
9
EUROPEAN
PROJECTION
ISSUE DATE
01-06-06
02-11-13