74LVT125 Datasheet, PDF (9/15 Pages) NXP Semiconductors – 3.3V Quad buffer 3-State

Philips Semiconductors
13. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
74LVT125
3.3 V quad buffer; 3-state
SOT108-1
D
y
Z
14
pin 1 index
1
e
E
A
X
c
H_E
vM A
8
A₂
A₁
7
b_p
wM
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT _max. A₁
A₂
A₃
b_p
c
D⁽¹⁾ E⁽¹⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8^o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0^o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT108-1
IEC
076E06
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SO14 (SOT108-1)
9397 750 14703
Product data sheet
Rev. 05 — 10 February 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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