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74F8965 Datasheet, PDF (8/11 Pages) NXP Semiconductors – 9-Bit address/data Futurebus transceiver, ADT
Philips Semiconductors FAST Products
9-Bit address/data Futurebus transceiver, ADT
Product specification
74F8965/74F8966
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
CONDITIONS1
LIMITS
UNIT
MIN TYP2 MAX
IOH
High–level output current
B0 – B8
VCC = MAX, VIL = MAX, VIH = MIN, VOH = 2.1V
100 µA
IAMC (74F8966) VCC = MAX, VIL = MAX, VIH = MIN, VOH = 4.5V
100 µA
IOFF
Power–off output current
B0 – B8
VCC = 0.0V, VIL = MAX, VIH = MIN, VOH = 2.1V
100 µA
IAMC (74F8966) VCC = 0.0V, VIL = MAX, VIH = MIN, VOH = 4.5V
VOH
High-level output voltage
A0 – A84
VCC = MAX, VIL = MAX, VIH = MIN, IOH = –3mA 2.4
A0 – A84
VCC = MIN,
IOL = 24mA
100 µA
VCC
V
0.50 V
VOL
Low-level output voltage IAMC (74F8966) VIL = MAX
IOL = 48mA
0.50 V
B0 – B8
VIH = MIN
IOL = 100mA
0.75 1.0 1.10 V
VIK
Input clamp voltage
VCC = MIN, II = IIK
OEB0, OEB1,
II
Input current at
OEA, LE, LS, VCC = MAX, VI = 7.0V
maximum input voltage
IAREQ
-1.2 V
100 µA
A0 – A8, B0 –
B8
VCC = MAX, VI = 5.5V
OEB0, OEB1,
OEA, LE, LS, VCC = MAX, VI = 2.7V
IIH
High–level input current
IAREQ
B0 – B8
VCC = MAX, VI = 2.1V
OEB0, OEB1,
OEA, LE, LS, VCC = MAX, VI = 0.5V
IIL
Low–level input current
IAREQ
B0 – B8
VCC = MAX, VI = 0.3V
1
mA
20 µA
100 µA
–100 µA
–100 µA
IIH + IOZH
Off–state output current,
high–level voltage applied
A0 – A8
VCC = MAX, VO = 2.7V
50 µA
IIL + IOZL
Off–state output current,
low–level voltage applied
VCC = MAX, VI = 0.5V
–50 µA
IOS
Short circuit output
current3
A0 – A8 only
AO8
ICCH
VCC = MAX
VCC = MAX
-60
-150 mA
80 140 mA
ICC
Supply current (total)
ICCL
VCC = MAX, VIL = 0.5V
85 145 mA
ICCZ
75 100 mA
Notes to DC electrical characteristics
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold tech-
niques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a
high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any sequence
of parameter tests, IOS tests should be performed last.
4. Due to test equipment limitations, actual test conditions are for VIH =1.8V and VIL = 1.3V.
December 19, 1990
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