TDA4662 Datasheet, PDF (7/12 Pages) NXP Semiconductors – Baseband delay line

Philips Semiconductors
Baseband delay line
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil)
Product specification
TDA4662
SOT38-4
D
L
Z
e
b
16
pin 1 index
A_{2 A}
A₁
wM
b₁
b₂
9
M_E
c
(e ₁)
M_H
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73 0.53
1.30 0.38
1.25 0.36 19.50 6.48
0.85 0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches _0.17
0.020
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.030
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-14
1996 Nov 14
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