TDA4662 Datasheet, PDF (4/12 Pages) NXP Semiconductors – Baseband delay line

Philips Semiconductors
Baseband delay line
Product specification
TDA4662
PINNING
SYMBOL PIN
DESCRIPTION
V_P2
1 supply voltage for digital part (+5 V)
n.c.
2 not connected
GND2
3 ground for digital part (0 V)
i.c.
4 internally connected
SAND
5 sandcastle pulse input
n.c.
6 not connected
i.c.
7 internally connected
i.c.
8 internally connected
V_P1
GND1
V_o(R−Y)
V_o(B−Y)
n.c.
V_i(B−Y)
n.c.
9 supply voltage for analog part (+5 V)
10 ground for analog part (0 V)
11 ±(R−Y) output signal
12 ±(B−Y) output signal
13 not connected
14 ±(B−Y) input signal
15 not connected
V_i(R−Y)
16 ±(R−Y) input signal
handbook, halfpage
VP2 1
n.c. 2
16 Vi(R_−Y)
15 n.c.
GND2 3
i.c. 4
SAND 5
n.c. 6
i.c. 7
14 Vi(B_−Y)
TDA4662
13 n.c.
12 Vo(B_−Y)
11 Vo(R_−Y)
10 GND1
i.c. 8
9 VP1
MED744
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Ground pins 3 and 10 connected together.
SYMBOL
V_P1
V_P2
V₅
V_n
T_stg
T_amb
V_ESD
PARAMETER
supply voltage (pin 9)
supply voltage (pin 1)
input voltage on pin 5
voltage on pins 11, 12, 14 and 16
storage temperature
operating ambient temperature
electrostatic handling for all pins
CONDITIONS
note 1
MIN.
−0.5
−0.5
−0.5
−0.5
−25
0
−
MAX.
+7
+7
V_P + 1.0
V_P
+150
70
±500
UNIT
V
V
V
V
°C
°C
V
Note
1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
R_{th j-a}
PARAMETER
thermal resistance from junction to ambient in free air
SOT38-4
SOT109-1
VALUE
75
220
UNIT
K/W
K/W
1996 Nov 14
4