SA5225 Datasheet, PDF (7/10 Pages) NXP Semiconductors – Fiber optic postamplifier

Philips Semiconductors
Fiber optic postamplifier
Product specification
SA5225
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
CAZN
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
V_SET
CAZP
2
1
16
15
V_REF
GNDA
3
14
V_CCE
DIN
DIN
4
5
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
13
12
DOUT
DOUT
V_CCA
CF
6
7
8
11
9
10
GND_E
ST
ECN No.: 01671
1991 Jul 8
JAM
1998 Oct 07
Figure 8. SA5225 Bonding Diagram
7
ST
SD00493