SA5224 Datasheet, PDF (7/10 Pages) NXP Semiconductors – FDDI fiber optic postamplifier

Philips Semiconductors
FDDI fiber optic postamplifier
Product specification
SA5224
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
CAZN
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
V_SET
CAZP
2
1
16
15
V_REF
GNDA
3
14
V_CCE
DIN
DIN
4
5
ÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈÈ
13
12
DOUT
DOUT
V_CCA
CF
6
7
8
11
9
10
GND_E
ST
ECN No.: 01673
1991 Feb 8
JAM
Figure 8. SA5224 Bonding Diagram
1998 Oct 07
7
ST
SD00492