SA5224 Datasheet, PDF (6/10 Pages) NXP Semiconductors – FDDI fiber optic postamplifier

Philips Semiconductors
FDDI fiber optic postamplifier
Product specification
SA5224
DATA IN
R₁
R₂
50X
2.64V
V_REF
.25X
V_CCA
C_F
LOW-PASS
FILTER
+
ST
ECL 100k
–
ST
LEVEL-
DETECT
FLAGS
Figure 6. SA5224 Input Signal Level-Detect System
SD00379
C_AZ
0.1µF
DATA IN
C_IN1
0.1µF
C_IN2
0.1µF
5V
0.1µF 0.1µF
1
C_AZN
2
C_AZP
3
GND_A
4
D_IN
5
D_IN
6
V_CCA
7
C_F
8
JAM
V_SET 16
V_REF 15
V_CCE 14
D_OUT
13
D_OUT
12
GND_E
11
ST
10
ST
9
R₁
R₂
5V
0.1µF
R₃
50Ω
DATA OUT
R₄
3V
50Ω
R₅
50Ω
LEVEL-DETECT
STATUS
Figure 7. Application with V_CC = 5.0V
SD00380
NOTE: A 50Ω resistor is required from Pin 9 to 3V only if the ST pin
is required to meet 100k ECL specifications.
Die Sales Disclaimer
Due to the limitations in testing high frequency and other parameters
at the die level, and the fact that die electrical characteristics may
shift after packaging, die electrical parameters are not specified and
die are not guaranteed to meet electrical characteristics (including
temperature range) as noted in this data sheet which is intended
only to specify electrical characteristics for a packaged device.
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25°C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
1998 Oct 07
6