BYC5D-500_15 Datasheet, PDF (7/11 Pages) NXP Semiconductors – BYC5D-500_15

NXP Semiconductors
7. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC
BYC5D-500
Hyperfast power diode
SOD59
E
P
q
D₁
D
H
A
A₁
Q
b₁
L
1
2
b
c
e
Dimensions
0
5
10 mm
scale
Unit
A A₁ b b₁₍₁₎ c
D D₁ E
e
H
L
P
Q
q
mm
max
nom
min
4.7
4.3
1.40 0.95
1.15 0.70
1.7
1.3
0.65 15.8
0.45 15.6
6.8 10.30 _5.08 16.25 15.0
6.4 9.65 ^(REF) 15.70 12.5
3.7
3.5
2.6
2.2
2.9
2.7
Note
1. Protruded dambar are included in the dimension.
Outline
version
References
IEC
JEDEC
JEITA
SOD59
2-lead TO-220AC
Fig 8. Package outline SOD59 (TO-220AC)
BYC5D-500
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 6 July 2011
European
projection
sod059_po
Issue date
09-08-17
09-08-25
© NXP B.V. 2011. All rights reserved.
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