74F552 Datasheet, PDF (7/14 Pages) NXP Semiconductors – Octal registered transceiver with parity and flags 3-State

Philips Semiconductors
Octal registered transceiver with parity and flags (3-State)
Product specification
74F552
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS^{NO TAG}
LIMITS
MIN
TYP
NO TAG
MAX
UNIT
FR, FS, ERROR
±10%V_CC
2.5
V
I_OH = –1mA
±5%V_CC
2.7
3.4
V
V_OH
High-level output
voltage
A0–A7
V_CC = MIN,
±10%V_CC
2.4
V_IL = MAX,
V_IH = MIN
I_OH = –3mA
±5%V_CC
2.7
3.3
V
V
±10%V_CC
2.0
V
B0–B7, PARITY
I_OH = –15mA
±5%V_CC
2.0
V
FR. FS. ERROR
I_OL = 20mA
±10%V_CC
±5%V_CC
V_OL
Low-level output
voltage
A0–A7
V_CC = MIN,
V_IL = MAX,
V_IH = MIN
I_OL = 24mA
±10%V_CC
±5%V_CC
0.30 0.50
V
0.30 0.50
V
0.35 0.50
V
0.35 0.50
V
B0–B7, PARITY
I_OL = 48mA
I_OL = 64mA
±10%V_CC
±5%V_CC
0.38 0.55
V
0.42 0.55
V
V_IK
Input clamp voltage
V_CC = MIN, I_I = I_IK
–0.73 –1.2
V
Input current at
others
I_I
maximum input
A0–A7, B0–B7,
voltage
PARITY
V_CC = MAX, V_I = 7.0V
V_CC = 5.5V, V_I = 5.5V
100
µA
1
mA
I_IH
High-level input
current
others except
A0–A7, B0–B7,
PARITY
V_CC = MAX, V_I = 2.7V
20
µA
I_IL
Low-level input
current
others
OEAS, OEBA
V_CC = MAX, V_I = 0.5V
–0.6
mA
–1.2
mA
I_OZH+I_IH
I_OZL+I_IL
Off-state output current
High-level voltage applied
Off-state output current
Low-level voltage applied
A0–A7,
B0–B7,
PARITY
V_CC = MAX, V_O = 2.7V
V_CC = MAX, V_O = 0.5V
70
µA
–600
µA
Short-circuit
A0–A7, FS, FR,
I_OS
output
ERROR
current^{NO TAG}
B0–B7, PARITY
V_CC = MAX
–60
–100
–150
mA
–225
mA
I_CC
Supply current
(total)
I_CCH
I_CCL
V_CC = MAX
115
170
mA
125
185
mA
I_CCZ
120
180
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value under the recommended operating conditions for the applicable type.
2. All typical values are at V_CC = 5V, T_amb = 25°C.
3. Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS should be performed last.
1991 Jan 02
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