BYC30WT-600P_15 Datasheet, PDF (6/9 Pages) NXP Semiconductors – Hyperfast power diode

NXP Semiconductors
BYC30WT-600P
Hyperfast power diode
11. Package outline
Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247
SOT429
E
q
D
p
E₂
E₃
A
A₁
ø
P₂
D₂
D₁
E₁
L₁
Q
b₁
L
b₂
e
b
c
0
20 mm
scale
Dimensions (mm are the original dimensions)
Unit⁽¹⁾
A A₁ b b₁ b₂
c
D D₁ D₂ E E₁ E₂ E₃ e⁽¹⁾ L L₁ P₂ p
Q
q
ø
max 5.20 2.10 1.40 2.20 3.20 0.70 20.6 17.68 1.20 15.75 14.22 5.20 1.80
20.90 4.75 3.60 3.70 2.60 6.18 7.30
mm nom
5.45
min 4.70 1.90 1.00 1.80 2.80 0.50 20.3 17.28 0.80 15.45 13.82 4.80 1.40
20.40 4.25 3.40 3.50 2.20 5.78 7.10
Note
1. Basic spacing between centers.
sot429_po
Outline
version
SOT429
References
IEC
JEDEC
JEITA
TO-247
European
projection
Issue date
04-09-14
13-03-25
Fig. 8. Package outline TO-247 (SOT429)
BYC30WT-600P
Product data sheet
All information provided in this document is subject to legal disclaimers.
10 February 2014
© NXP N.V. 2014. All rights reserved
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