BY558 Datasheet, PDF (6/8 Pages) NXP Semiconductors – Damper diodes

 Philips Semiconductors
Damper diodes
PACKAGE OUTLINE
Hermetically sealed glass package; axial leaded; 2 leads
(1)
k
D
L
G
DIMENSIONS (mm are the original dimensions)
UNIT
b
max.
D
max.
G
max.
L
min.
mm 1.35
5.5
6.0
27
Note
1. The marking band indicates the cathode.
OUTLINE
VERSION
IEC
SOD115
REFERENCES
JEDEC
EIAJ
Product specification
BY558; BY578
SOD115
a
b
L
0 2.5 5 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
97-10-14
1998 Jun 25
6