BY558 Datasheet, PDF (2/8 Pages) NXP Semiconductors – Damper diodes

Philips Semiconductors
Damper diodes
Product specification
BY558; BY578
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Also available with preformed leads
for easy insertion
• Designed to withstand transients
up to 1700 V.
DESCRIPTION
Rugged glass package, using a high
temperature alloyed construction.
handbook, halfpage
k
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
a
MAM384
APPLICATIONS
• For use in multi-sync monitor
horizontal deflection circuits
Fig.1 Simplified outline (SOD115) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
V_RSM
V_RRM
V_R
I_F(AV)
I_FRM
I_FSM
T_stg
T_j
non-repetitive peak reverse voltage
BY558
BY578
repetitive peak reverse voltage
BY558
BY578
continuous reverse voltage
average forward current
repetitive peak forward current
non-repetitive peak forward current
storage temperature
junction temperature
T_tp = 65 °C; see Fig.2;
PCB mounting; averaged over any
20 ms period; see Fig.4
t = 10 ms half sine wave;
T_j = T_{j max} prior to surge;
V_R = V_RRMmax
MIN.
−
−
−
−
−
−
−
−
−65
−65
MAX. UNIT
1500 V
1700 V
1500 V
1700 V
1400 V
2.5 A
12 A
80 A
+175 °C
+150 °C
1998 Jun 25
2