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BUK7535-55A_15 Datasheet, PDF (6/14 Pages) NXP Semiconductors – N-channel TrenchMOS standard level FET
NXP Semiconductors
BUK7535-55A
N-channel TrenchMOS standard level FET
6. Characteristics
Table 6. Characteristics
Symbol
Parameter
Conditions
Static characteristics
V(BR)DSS
VGS(th)
drain-source breakdown
voltage
ID = 0.25 mA; VGS = 0 V; Tj = 25 °C
ID = 0.25 mA; VGS = 0 V; Tj = -55 °C
gate-source threshold voltage ID = 1 mA; VDS = VGS; Tj = 25 °C;
see Figure 10
ID = 1 mA; VDS = VGS; Tj = 175 °C;
see Figure 10
ID = 1 mA; VDS = VGS; Tj = -55 °C;
see Figure 10
IDSS
IGSS
RDSon
drain leakage current
gate leakage current
drain-source on-state
resistance
VDS = 55 V; VGS = 0 V; Tj = 25 °C
VDS = 55 V; VGS = 0 V; Tj = 175 °C
VGS = 20 V; VDS = 0 V; Tj = 25 °C
VGS = -20 V; VDS = 0 V; Tj = 25 °C
VGS = 10 V; ID = 20 A; Tj = 175 °C;
see Figure 11; see Figure 12
VGS = 10 V; ID = 20 A; Tj = 25 °C;
see Figure 11; see Figure 12
Dynamic characteristics
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
LD
input capacitance
output capacitance
reverse transfer capacitance
turn-on delay time
rise time
turn-off delay time
fall time
internal drain inductance
LS
internal source inductance
Source-drain diode
VGS = 0 V; VDS = 25 V; f = 1 MHz;
Tj = 25 °C; see Figure 13
VDS = 30 V; RL = 1.2 Ω; VGS = 10 V;
RG(ext) = 10 Ω; Tj = 25 °C
from contact screw on mounting base
to centre of die ; Tj = 25 °C
from drain lead 6 mm from package to
centre of die ; Tj = 25 °C
from source lead to source bond pad ;
Tj = 25 °C
VSD
source-drain voltage
IS = 25 A; VGS = 0 V; Tj = 25 °C;
see Figure 14
trr
reverse recovery time
IS = 20 A; dIS/dt = -100 A/µs;
Qr
recovered charge
VGS = -10 V; VDS = 30 V; Tj = 25 °C
Min Typ Max Unit
55 -
-
V
50 -
-
V
2
3
4
V
1
-
-
V
-
-
4.4 V
-
0.05 10 µA
-
-
500 µA
-
2
100 nA
-
2
100 nA
-
-
70 mΩ
-
30
35
mΩ
-
650 872 pF
-
170 205 pF
-
110 153 pF
-
10
-
ns
-
62 -
ns
-
24
-
ns
-
20
-
ns
-
3.5 -
nH
-
4.5 -
nH
-
7.5 -
nH
-
0.85 1.2 V
-
40
-
ns
-
80
-
nC
BUK7535-55A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 January 2011
© NXP B.V. 2011. All rights reserved.
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