BLA0912-250 Datasheet, PDF (6/12 Pages) NXP Semiconductors – Avionics LDMOS transistor

Philips Semiconductors
40
C1 C2 C3 C4 C5
R1
R2
C6
BLA0912-250
Avionics LDMOS transistor
40
C8 C9 C10
60
C7
Dimensions in mm.
See Table 9 for list of components.
Fig 5. Component layout for class-AB test circuit.
001aab083
Table 9: List of components for class-AB test circuit (see Figure 5). ^[1]
Component Description
Value
Catalogue no.
C1
multilayer ceramic chip capacitor
1 nF
[3]
C2
multilayer ceramic chip capacitor
22 pF
[2]
C3
multilayer ceramic chip capacitor
1 nF
[3]
C4
KEMET tantalum SMD capacitor
47 µF
T491D476M020AS
C5
multilayer ceramic chip capacitor
56 pF
[2]
C6
multilayer ceramic chip capacitor
22 pF
[2]
C7
multilayer ceramic chip capacitor
47 pF
[2]
C8
KEMET tantalum SMD capacitor
22 µF
T491D226M020AS
C9
multilayer ceramic chip capacitor
1 nF
[3]
C10
multilayer ceramic chip capacitor
22 pF
[2]
R1
SMD resistor (0805)
51 Ω
R2
philips resistor
49.9 Ω
2333 156 14999
[1] Layout files are available on request in gerber and dxf format.
[2] American Technical Ceramics type 100A or capacitor of same quality.
[3] American Technical Ceramics type 100B or capacitor of same quality.
9397 750 13275
Product data sheet
Rev. 02 — 22 July 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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