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BYC5X-600P_15 Datasheet, PDF (5/11 Pages) NXP Semiconductors – Hyperfast power diode
NXP Semiconductors
BYC5X-600P
Hyperfast power diode
9. Thermal characteristics
Table 6.
Symbol
Rth(j-h)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
heatsink
thermal resistance
from junction to
ambient
Conditions
with heatsink compound; Fig. 5
in free air
10
Zth(j-h)
(K/W)
1
Min Typ Max Unit
-
-
6.5 K/W
-
55
-
K/W
aaa-015788
10-1
δ = 0.5
δ = 0.3
δ = 0.1
10-2
δ = 0.05
δ = 0.02
δ = 0.01
10-3
single pulse
P
δ = tp
T
10-4
10-6
10-5
10-4
10-3
10-2
10-1
tp
t
T
1
10
tp (s)
Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse duration
10. Isolation characteristics
Table 7. Isolation characteristics
Symbol
Parameter
Conditions
Visol(RMS)
RMS isolation voltage
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
Cisol
isolation capacitance f = 1 MHz; from cathode to external
heatsink
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
BYC5X-600P
Product data sheet
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24 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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