BUK127-50GT Datasheet, PDF (5/7 Pages) NXP Semiconductors – PowerMOS transistor Logic level TOPFET

Philips Semiconductors
PowerMOS transistor
Logic level TOPFET
MECHANICAL DATA
Plastic surface mounted package; collector pad for good heat transfer; 4 leads
Product specification
BUK127-50GT
SOT223
D
B
E
A
X
c
y
H_E
b₁
4
vM A
A₁
1
2
3
e₁
b_p
e
wM B
Q
A
L_p
detail X
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A₁ bp b₁
c
D
E
e
e₁ H_E L_p
Q
v
w
y
mm
1.8 0.10 0.80 3.1 0.32 6.7
1.5 0.01 0.60 2.9 0.22 6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
SOT223
REFERENCES
IEC
JEDEC
EIAJ
SC-73
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
Fig.2. SOT223 surface mounting package¹.
1 For further information, refer to surface mounting instructions for SOT223 envelope. Epoxy meets UL94 V0 at 1/8". Net Mass: 0.11 g
December 2001
5
Rev 2.000