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BUJ302AD_15 Datasheet, PDF (5/14 Pages) NXP Semiconductors – NPN power transistor
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NXP Semiconductors
BUJ302AD
NPN power transistor
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to
mounting base
see Figure 5
thermal resistance from junction to ambient in free air
Min Typ Max Unit
-
-
1.56 K/W
-
60 -
K/W
10
001aab998
Zth(j-mb)
(K/W)
1 δ = 0.5
10−1
0.2
0.1
0.05
0.02
0.01
Ptot
δ = tp
T
10−2
10−5
10−4
10−3
10−2
10−1
tp
t
T
1
10
tp (s)
Fig 5. Transient thermal impedance from junction to mounting base as a function of pulse width
BUJ302AD
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 28 March 2011
© NXP B.V. 2011. All rights reserved.
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