BC177 Datasheet, PDF (5/8 Pages) NXP Semiconductors – PNP general purpose transistor

Philips Semiconductors
PNP general purpose transistor
PACKAGE OUTLINE
Metal-can cylindrical single-ended package; 3 leads
Product specification
BC177
SOT18/13
j
B
k
A
α
1
2
3
a
D
D₁
A
seating plane
w M AMBM
b
L
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
a
b
D
D1
j
k
L
w
α
mm
5.31
4.74
2.54
0.47
0.41
5.45 4.70
5.30 4.55
1.03
0.94
1.1
0.9
15.0
12.7
0.40
45°
OUTLINE
VERSION
SOT18/13
IEC
B11/C7 type 3
REFERENCES
JEDEC
EIAJ
TO-18
1997 Jun 04
5
EUROPEAN
PROJECTION
ISSUE DATE
97-04-18