SC16C650A Datasheet, PDF (47/50 Pages) NXP Semiconductors – Universal Asynchronous Receiver/Transmitter (UART) with 32-byte FIFO and infrared (IrDA) encoder/decoder

Philips Semiconductors
SC16C650A
UART with 32-byte FIFO and IrDA encoder/decoder
12.4 Package related soldering information
Table 29: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting
Package^[1]
Soldering method
Wave
Reflow^[2] Dipping
Through-hole
mount
DBS, DIP, HDIP, SDIP, SIL suitable^[3]
−
suitable
Surface mount
BGA, LBGA, LFBGA,
SQFP, SSOP-T^[4],
TFBGA, VFBGA
not suitable
suitable −
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable^[5]
suitable −
PLCC^[6], SO, SOJ
suitable
suitable −
LQFP, QFP, TQFP
not recommended^[6][7] suitable −
SSOP, TSSOP, VSO,
VSSOP
not recommended^[8] suitable −
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[4] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[5] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[6] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[7] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[8] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9397 750 11622
Product data
Rev. 04 — 20 June 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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