TEA6821T Datasheet, PDF (45/47 Pages) NXP Semiconductors – ICE car radio

Philips Semiconductors
ICE car radio
PACKAGE OUTLINE
VSO56: plastic very small outline package; 56 leads
Preliminary specification
TEA6821T
SOT190-1
D
y
Z
56
c
29
E
A
X
H_E
vM A
pin 1 index
1
e
A₂
A₁
28
wM
b_p
Q
(A ₃)
A
θ
L_p
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D⁽¹⁾ E⁽²⁾
e
H_E
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
mm
3.3
0.3
0.1
3.0
2.8
0.25
0.42
0.30
0.22 21.65 11.1
0.14 21.35 11.0
0.75
15.8
15.2
2.25
1.6
1.4
1.45
1.30
0.2
0.1
0.1
0.90
0.55
7^o
inches
0.13
0.012
0.004
0.12
0.11
0.01
0.017 0.0087 0.85
0.012 0.0055 0.84
0.44
0.43
0.0295
0.62
0.60
0.089
0.063
0.055
0.057
0.051
0.008
0.004
0.004
0.035
0.022
0^o
Note
1. Plastic or metal protrusions of 0.3 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT190-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
96-04-02
97-08-11
September 1993
45