BY278 Datasheet, PDF (4/7 Pages) NXP Semiconductors – Damper diode

Philips Semiconductors
Damper diode
Product specification
BY278
GRAPHICAL DATA
1.25
handbook, halfpage
Ptot
(W)
1.00
MBH407
0.75
0.50
0.25
0
0
1
2
3
4
5
IFWM (A)
Solid line: basic high-voltage E/W modulator circuit; see Fig.8.
Dotted line: basic conventional horizontal deflection circuit; see Fig.9.
Curves include power dissipation due to switching losses.
Fig.2 Maximum total power dissipation as a
function of working peak forward current.
5
handbook, halfpage
IF
(A)
4
3
MBH408
2
1
0
0
1
VF (V)
2
Dotted line: T_j = 150 °C.
Solid line: T_j = 25 °C.
Fig.3 Forward current as a function of forward
voltage; maximum values.
50
handbook, halfpage
25
7
50
handbook, halfpage
35
10
3 cm²
copper
3 cm²
copper
30
2
3
MGA200
10
25.4
MGA204
Dimensions in mm.
Fig.4 Device mounted on a printed-circuit board.
Dimensions in mm.
Fig.5 Mounting with additional printed-circuit
board for heat sink purposes.
1996 Sep 26
4