74F74 Datasheet, PDF (4/8 Pages) NXP Semiconductors – Dual D-type flip-flop

Philips Semiconductors
Dual D-type flip-flop
Product specification
74F74
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS¹
LIMITS
UNIT
MIN TYP² MAX
±10%V_CC 2.5
V
V_OH
High-level output voltage
V_CC = MIN, V_IL = MAX, V_IH = MIN I_OH = MAX _±5%VCC
2.7
3.4
V
V_OL
Low-level output voltage
±10%V_CC
V_CC = MIN, V_IL = MAX, V_IH = MIN I_OL = MAX _±5%VCC
0.30 0.50
V
0.30 0.50
V
V_IK
Input clamp voltage
V_CC = MIN, I_I = I_IK
-0.73 -1.2
V
I_I
Input current at maximum input
voltage
V_CC = MAX, V_I = 7.0V
100 µA
I_IH
High-level input current
V_CC = MAX, V_I = 2.7V
20
µA
I_IL
Low-level input
current
Dn, CPn V_CC = MAX, V_I = 0.5V
SDn, RDn V_CC = MAX, V_I = 0.5V
-0.6 mA
-1.8 mA
I_OS
Short-circuit output current³
V_CC = MAX
-60
-150 mA
I_CC
Supply current (total) ⁴
V_CC = MAX
11.5 16
mA
NOTES:
1 For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2 All typical values are at V_CC = 5V, T_amb = 25°C.
3 Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS tests should be performed last.
4 Measure I_CC with the clock input grounded and all outputs open, then with Q and Q outputs high in turn.
AC ELECTRICAL CHARACTERISTICS
SYMBOL
PARAMETER
TEST
CONDITION
f_max
Maximum clock frequency Waveform 1
t_PLH
Propagation delay
t_PHL
CPn to Qn or Qn
Waveform 1
t_PLH
t_PHL
Propagation delay
SDn, RDn to Qn or Qn
Waveform 2
V_CC = +5.0V
T_amb = +25°C
C_L = 50pF, R_L = 500Ω
MIN TYP MAX
100 125
3.8 5.3 6.8
4.4 6.2 8.0
3.2 4.6 6.1
3.5 7.0 9.0
LIMITS
V_CC = +5.0V ± 10%
T_amb = 0°C to +70°C
C_L = 50pF, R_L = 500Ω
MIN
MAX
V_CC = +5.0V ± 10%
T_amb = –40°C to +85°C
C_L = 50pF, R_L = 500Ω
MIN
MAX
100
90
3.8
7.8
3.8
8.5
4.4
9.2
4.4
9.2
3.2
7.1
3.2
7.5
3.5
10.5
2.5
10.5
UNIT
MHz
ns
ns
AC SETUP REQUIREMENTS
SYMBOL
PARAMETER
t_su (H)
t_su (L)
t_h (H)
t_h (L)
t_w (H)
t_w (L)
t_w (L)
t_rec
Setup time, high or low
Dn to CPn
Hold time, high or low
Dn to CPn
CPn pulse width,
high or low
SDn, RDn pulse width,
low
Recovery time
SDn, RDn to CPn
TEST
CONDITION
Waveform 1
Waveform 1
Waveform 1
V_CC = +5.0V
T_amb = +25°C
C_L = 50pF, R_L = 500Ω
MIN TYP MAX
2.0
3.0
1.0
1.0
4.0
5.0
LIMITS
V_CC = +5.0V ± 10%
T_amb = 0°C to +70°C
C_L = 50pF, R_L = 500Ω
MIN
MAX
V_CC = +5.0V ± 10%
T_amb = –40°C to +85°C
C_L = 50pF, R_L = 500Ω
MIN
MAX
2.0
2.0
3.0
3.0
1.0
1.0
1.0
1.0
4.0
4.0
5.0
5.0
UNIT
ns
ns
ns
Waveform 2 4.0
4.0
4.0
ns
Waveform 3 2.0
2.0
2.0
ns
1996 Mar 12
4