TDA8922C_15 Datasheet, PDF (38/40 Pages) NXP Semiconductors – 2X75 W class-D power amplifier

NXP Semiconductors
TDA8922C
2 × 75 W class-D power amplifier
16.4 Package related soldering information
Table 14. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
suitable^[1]
PMFP^[2]
-
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
17. Revision history
Table 15. Revision history
Document ID
Release date
TDA8922C_1
20090907
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
TDA8922C_1
Product data sheet
Rev. 01 — 7 September 2009
© NXP B.V. 2009. All rights reserved.
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