NVT2006BS Datasheet, PDF (33/33 Pages) NXP Semiconductors – Bidirectional voltage-level translator for open-drain and push-pull applications

NXP Semiconductors
NVT2003/04/06
Bidirectional voltage-level translator
20. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1 20
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
3.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
5
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
5.1
5.1.1
5.1.2
5.1.3
5.2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3-bit in TSSOP10 package . . . . . . . . . . . . . . . . 3
4-bit in HXSON12 package. . . . . . . . . . . . . . . . 3
6-bit in TSSOP16, DHVQFN16
and HVQFN16 packages . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
6
Functional description . . . . . . . . . . . . . . . . . . . 5
6.1
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Application design-in information . . . . . . . . . . 6
7.1
Enable and disable . . . . . . . . . . . . . . . . . . . . . . 6
7.2
Bidirectional translation . . . . . . . . . . . . . . . . . . 8
7.3
Bidirectional level shifting between two
different power domains nominally
at the same potential . . . . . . . . . . . . . . . . . . . . 8
7.4
How to size pull-up resistor value . . . . . . . . . . . 9
7.5
How to design for maximum frequency
operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
9
Recommended operating conditions. . . . . . . 13
10
Static characteristics. . . . . . . . . . . . . . . . . . . . 13
11
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
11.1
Open-drain drivers . . . . . . . . . . . . . . . . . . . . . 15
12
Performance curves . . . . . . . . . . . . . . . . . . . . 16
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
14
Soldering of SMD packages . . . . . . . . . . . . . . 22
14.1
Introduction to soldering . . . . . . . . . . . . . . . . . 22
14.2
Wave and reflow soldering . . . . . . . . . . . . . . . 22
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
14.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
15
Soldering: PCB footprints. . . . . . . . . . . . . . . . 25
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 30
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 30
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 31
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
18.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 32
19
Contact information. . . . . . . . . . . . . . . . . . . . . 32
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 19 February 2014
Document identifier: NVT2003_04_06