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PXT3906 Datasheet, PDF (3/8 Pages) NXP Semiconductors – PNP switching transistor | |||
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Philips Semiconductors
PNP switching transistor
Product speciï¬cation
PXT3906
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS VALUE
UNIT
Rth j-a
Rth j-s
thermal resistance from junction to ambient
thermal resistance from junction to soldering point
note 1
104
K/W
24
K/W
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 6 cm2.
For other mounting conditions, see âThermal considerations for SOT89 in the General Part of associated Handbookâ.
CHARACTERISTICS
Tj = 25 °C unless otherwise speciï¬ed.
SYMBOL
PARAMETER
CONDITIONS
MIN.
ICBO
IEBO
hFE
VCEsat
VBEsat
Cc
Ce
fT
F
collector cut-off current
emitter cut-off current
DC current gain
collector-emitter saturation
voltage
base-emitter saturation voltage
collector capacitance
emitter capacitance
transition frequency
noise ï¬gure
IE = 0; VCB = â30 V
IC = 0; VEB = â6 V
VCE = â1 V; (see Fig.2)
IC = â0.1 mA
IC = â1 mA
IC = â10 mA
IC = â50 mA
IC = â100 mA
IC = â10 mA; IB = â1 mA
IC = â50 mA; IB = â5 mA
IC = â10 mA; IB = â1 mA
IC = â50 mA; IB = â5 mA
IE = ie = 0; VCB = â5 V; f = 1 MHz
IC = ic = 0; VEB = â500 mV; f = 1 MHz
IC = â10 mA; VCE = â20 V; f = 100 MHz
IC = â100 µA; VCE = â5 V; RS = 1 kâ¦;
f = 10 Hz to 15.7 kHz
â
â
60
80
100
60
30
â
â
â650
â
â
â
250
â
Switching times (between 10% and 90% levels); (see Fig.3)
ton
turn-on time
td
delay time
tr
rise time
toff
turn-off time
ts
storage time
tf
fall time
ICon = â10 mA; IBon = â1 mA; IBoff = 1 mA â
â
â
â
â
â
MAX.
â50
â50
UNIT
nA
nA
â
â
300
â
â
â250
â400
â850
â950
4.5
10
â
4
mV
mV
mV
mV
pF
pF
MHz
dB
65
ns
35
ns
35
ns
300
ns
225
ns
75
ns
1999 Apr 14
3
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