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PDTC114TT Datasheet, PDF (3/8 Pages) NXP Semiconductors – NPN resistor-equipped transistor
Philips Semiconductors
NPN resistor-equipped transistor
Objective specification
PDTC114TT
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-a
thermal resistance from junction to ambient
Note
1. Transistor mounted on an FR4 printed-circuit board.
CONDITIONS
note 1
VALUE
500
UNIT
K/W
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
ICBO
ICEO
IEBO
hFE
VCEsat
R1
Cc
collector cut-off current
collector cut-off current
emitter cut-off current
DC current gain
collector-emitter saturation voltage
input resistor
collector capacitance
IE = 0; VCB = 50 V
IB = 0; VCE = 30 V
IB = 0; VCE = 30 V; Tj = 150 °C
IC = 0; VEB = 5 V
IC = 1 mA; VCE = 5 V
IC = 10 mA; IB = 0.5 mA
IE = ie = 0; VCB = 10 V;
f = 1 MHz
MIN.
−
−
−
−
200
−
7
−
TYP.
−
−
−
−
−
−
10
−
MAX.
100
1
50
100
−
150
13
2.5
UNIT
nA
µA
µA
nA
mV
kΩ
pF
600
handbook, halfpage
(1)
hFE
400
(2)
(3)
200
MGM902
10−1
handbook, halfpage
VCEsat
(V)
MGM901
(1)
(2)
(3)
0
10−1
1
10
102
IC (mA)
VCE = 5 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −40 °C.
Fig.3 DC current gain as a function of collector
current; typical values.
10−2
10−1
1
10
102
IC (mA)
IC/IB = 10.
(1) Tamb = 100 °C.
(2) Tamb = 25 °C.
(3) Tamb = −40 °C.
Fig.4 Collector-emitter saturation voltage as a
function of collector current; typical values.
1999 Apr 16
3