EFD25 Datasheet, PDF (3/6 Pages) NXP Semiconductors – EFD cores and accessories

Philips Components
EFD cores and accessories
Product specification
EFD25
COIL FORMERS
General data
PARAMETER
Coil former material
Pin material
Maximum operating temperature
Resistance to soldering heat
Solderability
SPECIFICATION
phenolformaldehyde (PF), glass-reinforced, flame retardant in accordance with
“UL 94V-0”; UL file number E167521(M)
copper-tin alloy (CuSn), tin-lead alloy (SnPb) plated
180 °C, “IEC 85” class H
“IEC 68-2-20”, Part 2, Test Tb, method 1B, 350 °C, 3.5 s
“IEC 68-2-20”, Part 2, Test Ta, method 1
handbook, full pagewidth
12.5
max
12
0
0.2
3.6
0
18 _0.2
13.1
0
0.1
11.7
0.1
0
5.5
0.1
0
6.9
0
0.1
10
20
25.2 max
18
0
0.2
(16.4 min)
O 0.8
22.5
26.2 max
5
0.05
22.5
1.3
0.15
0
MGC343
Dimensions in mm.
Fig.2 EFD25 coil former; 10-pins.
Winding data for EFD25 coil former with 10-pins
NUMBER OF
SECTIONS
1
WINDING
AREA
(mm²)
40.2
MINIMUM
WINDING
WIDTH
(mm)
16.4
AVERAGE
LENGTH OF
TURN
(mm)
46.4
TYPE NUMBER
CSH-EFD25-1S-10P
1997 Nov 21
3