BYD127 Datasheet, PDF (3/8 Pages) NXP Semiconductors – Ultra fast low-loss rectifier

Philips Semiconductors
Ultra fast low-loss rectifier
Product specification
BYD127
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE UNIT
R_{th j-tp}
R_{th j-a}
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
30
K/W
150 K/W
Note
1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 µm, see Fig.7.
For more information please refer to the “General part of the associated handbook”.
1999 Nov 15
3