SA58672 Datasheet, PDF (27/27 Pages) NXP Semiconductors – 3.0 W mono class-D audio amplifier

NXP Semiconductors
SA58672
3.0 W mono class-D audio amplifier
20. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1 19
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 20
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
9
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
10
Typical characterization curves . . . . . . . . . . . . 7
11
Application information. . . . . . . . . . . . . . . . . . 13
11.1
Power supply decoupling considerations . . . . 13
11.2
Voltage gain . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11.3
Input capacitor selection . . . . . . . . . . . . . . . . . 13
11.4
PCB layout considerations . . . . . . . . . . . . . . . 14
11.5
Evaluation demo board. . . . . . . . . . . . . . . . . . 14
11.6
Filter-free operation and ferrite bead filters. . . 15
11.7
Efficiency and thermal considerations . . . . . . 16
11.8
Additional thermal information . . . . . . . . . . . . 16
12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
12.1
Test setup for typical characterization curves . 17
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
14
Soldering of SMD packages . . . . . . . . . . . . . . 20
14.1
Introduction to soldering . . . . . . . . . . . . . . . . . 20
14.2
Wave and reflow soldering . . . . . . . . . . . . . . . 20
14.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 20
14.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 21
15
Soldering of WLCSP packages. . . . . . . . . . . . 22
15.1
15.2
15.3
15.3.1
15.3.2
15.3.3
15.3.4
Introduction to soldering WLCSP packages . . 22
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 22
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Quality of solder joint . . . . . . . . . . . . . . . . . . . 24
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
16
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
18.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
18.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 23 February 2009
Document identifier: SA58672_2