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SA58672 Datasheet, PDF (22/27 Pages) NXP Semiconductors – 3.0 W mono class-D audio amplifier | |||
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NXP Semiconductors
SA58672
3.0 W mono class-D audio ampliï¬er
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature proï¬les for large and small components
For further information on temperature proï¬les, refer to Application Note AN10365
âSurface mount reï¬ow soldering descriptionâ.
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 âWafer Level Chip Scale Packageâ and in application note AN10365 âSurface
mount reï¬ow soldering descriptionâ.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reï¬ow soldering itself
15.3 Reï¬ow soldering
Key characteristics in reï¬ow soldering are:
⢠Lead-free versus SnPb soldering; note that a lead-free reï¬ow process usually leads to
higher minimum peak temperatures (see Figure 19) than a PbSn process, thus
reducing the process window
SA58672_2
Product data sheet
Rev. 02 â 23 February 2009
© NXP B.V. 2009. All rights reserved.
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