TDA8310 Datasheet, PDF (21/24 Pages) NXP Semiconductors – PAL/NTSC colour processor for PIP applications

Philips Semiconductors
PAL/NTSC colour processor for
PIP applications
PACKAGE OUTLINE
Preliminary specification
TDA8310
handbook, full pagewidth
3.2
2.8
1.73
max
52
1
47.92
47.02
1.778
(25x)
4.57 5.08
max max
0.51
min
0.18 M
0.53
max
1.3 max
15.80
15.24
0.32 max
15.24
17.15
15.90
MSA267
27
14.1
13.7
26
Dimensions in mm.
Fig.4 Plastic shrink dual in-line package; 52 leads; 600 mil (SDIP52, SOT247-1).
SOLDERING
Plastic dual in-line packages
BY DIP OR WAVE
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.
February 1995
21