|
GTL1655DGG Datasheet, PDF (21/23 Pages) NXP Semiconductors – 16-bit LVTTL-to-GTL/GTL+ bus transceiver with live insertion | |||
|
◁ |
Philips Semiconductors
GTL1655
16-bit LVTTL-to-GTL/GTL+ bus transceiver with live insertion
[3] These transparent plastic packages are extremely sensitive to reï¬ow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reï¬ow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reï¬ow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is deï¬nitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is deï¬nitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on ï¬ex foil. However, the image sensor package can be mounted by the client on a ï¬ex
foil by using a hot bar soldering process. The appropriate soldering proï¬le can be provided on
request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Revision history
Table 19: Revision history
Rev Date
CPCN
Description
01 20040511 -
Product data (9397 750 12936).
9397 750 12936
Product data
Rev. 01 â 11 May 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
21 of 23
|
▷ |