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SA58637_15 Datasheet, PDF (20/22 Pages) NXP Semiconductors – 2 x 2.2 W BTL audio amplifier | |||
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NXP Semiconductors
SA58637
2 à 2.2 W BTL audio ampliï¬er
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature proï¬les for large and small components
For further information on temperature proï¬les, refer to Application Note AN10365
âSurface mount reï¬ow soldering descriptionâ.
17. Abbreviations
Table 11. Abbreviations
Acronym
Description
BTL
Bridge-Tied Load
CMOS
Complementary Metal Oxide Semiconductor
DAP
Die Attach Paddle
ESD
ElectroStatic Discharge
HF
High-Frequency
NPN
Negative-Positive-Negative
PCB
Printed-Circuit Board
PNP
Positive-Negative-Positive
RMS
Root Mean Squared
SE
Single-Ended
THD
Total Harmonic Distortion
18. Revision history
Table 12. Revision history
Document ID
Release date
SA58637_1
20080225
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
SA58637_1
Product data sheet
Rev. 01 â 25 February 2008
© NXP B.V. 2008. All rights reserved.
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