SA58637_15 Datasheet, PDF (13/22 Pages) NXP Semiconductors – 2 x 2.2 W BTL audio amplifier

NXP Semiconductors
SA58637
2 × 2.2 W BTL audio amplifier
6
(1)
P
(W)
(2)
4
002aac283
2
(3)
0
0
40
80
120
160
T_amb (°C)
(1) 64.5 mm² (10 in²) heat spreader top and bottom, 28.3 g (1 oz copper).
(2) 32.3 mm² (5 in²) heat spreader top or bottom, 28.3 g (1 oz copper).
(3) No heat spreader.
Fig 11. Power dissipation as a function of ambient temperature
The characteristics curves (Figure 12a and Figure 12b, Figure 13, Figure 14, and
Figure 15a and Figure 15b) show the room temperature performance for SA58637 using
the demo PCB shown in Figure 16. For example, Figure 12 “Power dissipation as a
function of output power” (a and b) show the performance as a function of load resistance
and supply voltage. Worst case power dissipation is shown in Figure 13. Figure 15a
shows that the part delivers typically 2.8 W per channel for THD+N = 10 % using 8 Ω load
at 9 V supply, while Figure 15b shows that the part delivers 3.3 W per channel at 12 V
supply and 16 Ω load, THD+N = 10 %.
3
P
(W)
(3)
2
(2)
1
(1)
002aac288
3
(4)
P
(W)
2
(3)
(2)
1
(1)
002aac289
0
0
1
(1) V_CC = 6 V.
(2) V_CC = 7.5 V.
(3) V_CC = 9 V.
2
3
P_o (W)
a. R_L = 8 Ω; f = 1 kHz; G_v = 20 dB
Fig 12. Power dissipation as a function of output power
0
0
1
2
3
4
P_o (W)
(1) V_CC = 6 V.
(2) V_CC = 7.5 V.
(3) V_CC = 9 V.
(4) V_CC = 12 V.
b. R_L = 16 Ω; f = 1 kHz; G_v = 20 dB
SA58637_1
Product data sheet
Rev. 01 — 25 February 2008
© NXP B.V. 2008. All rights reserved.
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