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OM6206 Datasheet, PDF (20/36 Pages) NXP Semiconductors – 65 X 102 pixels matrix LCD driver
Philips Semiconductors
65 × 102 pixels matrix LCD driver
Product specification
OM6206
SYMBOL
PARAMETER
TC1
VLCD temperature
coefficient 1
TC2
VLCD temperature
coefficient 2
TC3
VLCD temperature
coefficient 3
CONDITIONS
note 7
note 7
note 7
MIN.
TYP.
MAX. UNIT
−
−0.76 × 10−3VLCD −
V/°C
−
−1.05 × 10−3VLCD −
V/°C
−
−2.10 × 10−3VLCD −
V/°C
Notes
1. The maximum possible VLCD voltage that may be generated is dependent on voltage, temperature and (display) load.
2. Internal clock.
3. During Power-down mode, all static currents are switched off.
4. If external VLCD, the display load current is not transmitted to IDD.
5. Tolerance depends on the temperature; typical null at Tamb = 27 °C; maximum tolerance values are measured at the
temperate range limit; maximum tolerance is proportional to VLCD.
6. For TC1 to TC3.
7. VDD = 2.8 V; no serial clock; Tamb = −20 to +70 °C; display load = 10 µA.
12 AC CHARACTERISTICS
VDD = 2.5 to 5.5 V; VSS = 0 V; VLCD = 4.5 to 9.0 V; Tamb = −40 to +85 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
fosc
fext
fframe
tVHRL
tRW
oscillator frequency
external clock frequency
frame frequency
VDD HIGH to RES LOW time
RES LOW pulse width
VDD = 2.8 V; Tamb = −20 to +70 °C 22
20
fosc or fext = 38 kHz; note 1
−
see Fig.16
0 (2)
see Fig.16
100
Serial bus timing characteristics; see Fig.15
fSCLK
clock frequency
VDD = 3.0 V ±10%; note 3
0
tCYC
SCLK clock cycle time
250
tPWH1
SCLK pulse width HIGH
100
tPWL1
SCLK pulse width LOW
100
tS2
SCE setup time
60
tH2
SCE hold time
100
tPWH2
SCE HIGH time
100
tH5
SCE start hold time
note 4
100
tS3
D/C setup time
100
tH3
D/C hold time
100
tS4
SDIN setup time
100
tH4
SDIN hold time
100
TYP.
38
38
73
−
−
−
−
−
−
−
−
−
−
−
−
−
−
MAX.
67
67
−
1
−
4
−
−
−
−
−
−
−
−
−
−
−
UNIT
kHz
kHz
Hz
µs
ns
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes
1. fframe = 5--f-e-2--x-0-t-
2001 Nov 14
20