BYD67 Datasheet, PDF (2/8 Pages) NXP Semiconductors – Ripple blocking diode

Philips Semiconductors
Ripple blocking diode
Product specification
BYD67
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Shipped in 8 mm embossed tape
• Smallest surface mount rectifier
package.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec™⁽¹⁾
technology. The SOD87 is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
k
a
MAM061
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
V_RRM
V_R
I_F(AV)
repetitive peak reverse voltage
continuous reverse voltage
average forward current
I_FRM
repetitive peak forward current
I_FSM
non-repetitive peak forward current
T_stg
storage temperature
T_j
junction temperature
CONDITIONS
T_tp = 85 °C; see Fig.2;
averaged over any 20 ms period;
see also Fig.4
T_amb = 60 °C; PCB mounting (see
Fig.8); see Fig.3;
averaged over any 20 ms period;
see also Fig.4
T_tp = 85 °C
T_amb = 60 °C
t = 10 ms half sine wave;
T_j = 25 °C prior to surge;
V_R = V_RRMmax
MIN.
−
−
−
−
−
−
−
−65
−65
MAX.
300
300
1.2
UNIT
V
V
A
0.4
A
11
A
3.7
A
5.0
A
+175 °C
+175 °C
1999 Oct 20
2